The Beam On Technology Area Ratio Calculator gives you the ability to quickly calculate the stencil area ratio of an opening. It allows you to determine an aperture’s solder paste transfer efficiency and the optimum foil thickness needed.
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You can calculate the Area ratio for Rectangle, Square and Round shapes.
Aperture size can be entered in mils or millimeters.
Aperture size and foil thickness can be independently manipulated to determine optimal paste release.
The app also provides paste volume calculation and aspect ratio calculation.
For solder paste selection the app will also indicate the recommended powder size for the indicated opening.
App Provides you the below information pertaining to the Aperture