Superior paste release


Current trends show PCB assemblies are progressing toward smaller apertures and higher component density. Our goal is to provide consistent printing capability where area ratios drop below the 0.66 threshold.

Over the past two years, we have worked extensively with our customers to develop postproduction enhancements to our stencil fabrication processes. We have developed an innovative solution called EpoCoat.

How can EpoCoat help you?

  • Saves production costs
  • Reduces consumables costs
  • Faster production
  • Consistent through production cycles
  • Reduces defects

By increasing the fluxophobic properties of the stencil we enhance paste release, reduce misprints and improve reliability. Production becomes more efficient, raising performance capability.

How does EpoCoat work?

Original Image Non-EpoCoat

EpoCoat stencils are cut using the latest stencil laser systems from LPKF delivering 100 watts of cutting power calibrated at a very fine beam measuring less than 25 microns. With this technology, we are able to cut ultrafine apertures with precise walls. We pretreat the assist gas used in our lasers to minimize oxidation on the walls as an effort to reduce the formation of dross, a factor that can result in poor paste release. Foils being cut are held under precise and taut conditions, which are mounted on specially fabricated frames to ensure accurate measurement of 7 microns.


After laser processing, the foils are treated to a finely tuned electrochemical bath developed by Beam On Technology to undercut dross and polish the aperture walls without affecting the aperture size. The foil is then treated with a custom developed nano coating to provide uniform deposition.

EpoCoat stencils offer many benefits without the premium price: ultimate paste release, repeatability, and overall print performance.

Technical knowledge, Sensibly Applied

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