Beam On offers 3 choices of stencil types at competitive pricing with uncompromising quality and rapid lead times.

Proto Stencils

Proto Stencils or Lab Stencils are used for prototype or DOE (Design of experiments) purposes to test functionality or to exercise concepts. They have limited usage and therefore must be inexpensive.

Choose a Budget stencil for:

• Assemblies that are for test only.
• Extrememely limited runs of less than 10 boards.

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Framed Stencils

Framed Stencils are recommended for assemblies where quality is paramount. Superior foil tension is achieved through the use of tensioned polyester mesh attached to rigid aluminum frames. They offer consistent repeatability and uncompromising print quality.

Choose a framed stencil for:

• Assemblies that have ultrafine pitch components, especially BGA’s and leadless devices where print ratios have values of 6.0 and below.
• Production runs when you need to achieve high yields on a consistent basis with predictable results and need a stencil that can withstand repeated prints
• Large boards that are too cumbersome to hand print using foil sheets or heavy frameless systems

Other frames are available by request.

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SMT Solder Paste Stencils, SMT Stencils Manufacturers in Silicon Valley, California, USA - We are the leading SMT Solder Paste stencil manufacturer in California and experts in SMT Solder paste stencils, Framed stencils, Frameless stencils, proto and step stencils

Frameless Stencils

We offer unframed stencils for both “Universal” and “LPKF Zelflex” systems. You may also specify any foil size you require up to 20”x 22”. You may also provide a foil pattern with your order or choose from several patterns we have on file.

Frameless Stencils are used for assemblies where cost effectiveness and storage considerations are important factors.

Choose a frameless stencil for:

• Protype or NPI (New Product Introduction) builds. When you will be assembling a limited amount of boards you may not require a fully framed stencil.
• Small assemblies with no fine pitch or critical components. Larger passives and 0.8mm pitch leaded devices should have adequate paste release even at greater thicknesses.
• Hand screening only a few boards

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